Porous Vacuum Chuck Table magnetic table For Semiconductor Wafer on Dicing Saw

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Zhengzhou Hongtuo Superabrasive Products Co., Ltd. - Honing .....

Semi-Automatic dicing saw for cutting wafer. $40,000.00 / Set. 1 Set ... ceramic table HTYP6-8V0201 Round porous ceramic vacuum chuck table for 6/8 inch silicon wafer ...

MicroAutomation Dicing Saw - UA...

MicroAutomation Dicing Saw . Startup: − Turn on the compressed air and set the pressure to 80PSI − The compressed air is critically required for the motor, failure to supply the proper pressure will cause thousands of dollars in damage to the machine − Turn on the cooling water − In Room 108A next door, it is the one with the green ...

MicroAutomation Dicing Saw - UA...

MicroAutomation Dicing Saw . Startup: − Turn on the compressed air and set the pressure to 80PSI − The compressed air is critically required for the motor, failure to supply the proper pressure will cause thousands of dollars in damage to the machine − Turn on the cooling water − In Room 108A next door, it is the one with the green ...

vacuumchucktable: 201...

Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes.This product is an uniform compact frame, high strength, good porosity, durable absorption, excellent quality with high efficiency, no pollution, high fixing precision.

US5981361A - Fabrication process of a semiconductor device .....

A method of fabricating a semiconductor device includes the steps of, after sawing a semiconductor substrate into individual semiconductor chips in a state that the semiconductor substrate is covered by an adhesive tape, applying a dry gas to the adhesive tape in a state that the adhesive tape carries thereon the semiconductor chips, applying an infrared radiation to the adhesive tape in a ...

Glossary - SIEGERT WAFER Gmb...

Process of cutting semiconductor wafer into individual chips each containing a complete semiconductor device. Large diameter wafer dicing is carried out by partially cutting the wafer along preferred crystallography planes using high precision saw with ultra-thin diamond blade.

Wafer Dicing: A Sticky Situation | Semiconductor Diges...

The jig is matched to the substrate, and a layer of rubber holds the wafer in place. Under each die or package is a vacuum hole. When the wafer is diced, the die or packages remain in the array until the next step in the process – pick-and-place or die bonding. One alternative to tape-based dicing, is a thick-wafer scribing process.

Wafer Dicing: A Sticky Situation | Semiconductor Diges...

The jig is matched to the substrate, and a layer of rubber holds the wafer in place. Under each die or package is a vacuum hole. When the wafer is diced, the die or packages remain in the array until the next step in the process – pick-and-place or die bonding. One alternative to tape-based dicing, is a thick-wafer scribing process.

Used Micromanipulator 450PM-A for Sal...

Micromanipulator 450PM-A Manual Analytical Probe Station. 6” dia. chuck with 8” x 8” X-Y movement. Manual lead screw control of stage. Manual chuck theta rotation. StereoZoom microscope on boom allows manual X-Y positioning. Includes two vacuum base precision probe manipulators. Platen is non magnetic.

4 Inch Porous Ceramic Porous Chuck Table With Uniform Size .....

Porous Ceramic Metal Chuck Tables Porous Chuck Table for Japanese, German and Chinese dicing saws . Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes.

Porous Ceramic Vacuum Chuck | INNOVACER...

Innovacera supply the Porous ceramic Chuck Table which are mainly used to support and chuck the semiconductor wafer when grinding and dicing. It is applied in the process of thinning, dicing, clearance, transportation and so on. Chuck Table Classification by applications: Thinning Chucks Dicing Chucks Cleaning Chucks Film Uncovered Chucks

Dicing Accessories- Chuck Table - Automatic Dicing Saw-NPMT .....

We customize porous ceramic vacuum tables of various sizes, either in round or square shape, magnetic or non-magnetic. Short lead time for producing new chuck tables or replacing ceramic. Reliable flatness, good porosity and high accuracy. Specifications

porous ceramic vacuum chuck table, porous ceramic vacuum .....

Magnetic Wafer Dicing Vacuum Chuck Table For Semiconductor Industry, Fabricate According To OEM Design High Flatness Control Up to 2 µm. Chuck Table Accuracies Size Flatness 4 inch 2 μ m 6 inch 2 μ m 8 inch 4 μ m 12 inch 4 μ m Eminent Precision Engineering Malaysia Most Quality Porous Ceramic Vacuum Chuck Table Manufacturer ,Fabricator And Repairer.

vacuumchucktable: 201...

Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes.This product is an uniform compact frame, high strength, good porosity, durable absorption, excellent quality with high efficiency, no pollution, high fixing precision.

4 Inch Porous Ceramic Porous Chuck Table With Uniform Size .....

Porous Ceramic Metal Chuck Tables Porous Chuck Table for Japanese, German and Chinese dicing saws . Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes.

semiXicon: 201...

We can save your money and time by refurbish ,rebuild or remodel the porous vacuum chuck for all DISCO dicing saw models: We keep 1-2 in store also for main stream dicing saws, that is to say you can expect delivery in some cases next day!

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